发明名称 |
HOUSING COMPRISING A HOUSING UNDERPART AND METHOD FOR EMITTING ELECTROMAGNETIC RADIATION |
摘要 |
A housing includes a housing underpart, the housing underpart being provided with a housing cavity. The housing cavity comprises an opening on one housing side and, on the floor of the cavity, contains an electromagnetic radiation emitting semiconductor chip. A cover that is at least partially transparent to the electromagnetic radiation covers the housing cavity. A method for emitting electromagnetic radiation in a preferred direction is also disclosed.
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申请公布号 |
US2009059588(A1) |
申请公布日期 |
2009.03.05 |
申请号 |
US20080198393 |
申请日期 |
2008.08.26 |
申请人 |
ENGL MORITZ;OSWALD FLORIN |
发明人 |
ENGL MORITZ;OSWALD FLORIN |
分类号 |
F21V13/00;H01L33/00;H01L33/48;H01L33/58 |
主分类号 |
F21V13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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