发明名称 MID-PLATES AND ELECTROMAGNETIC INTERFERENCE (EMI) BOARD LEVEL SHIELDS WITH EMBEDDED AND/OR INTERNAL HEAT SPREADERS
摘要 According to various aspects, exemplary embodiments are disclosed of mid-plates and EMI shields for electronic devices. In an exemplary embodiment, a mid-plate generally includes one or more recessed portions along a surface of the mid-plate. A heat spreader is within the one or more recessed portions. Dielectric is along an outward-facing surface of the heat spreader. The dielectric inhibits the heat spreader from directly contacting and electrically shorting one or more components. In another exemplary embodiment, a board level shield (BLS) generally includes a cover having one or more recessed portions along an inner surface of the cover. A heat spreader is within the one or more recessed portions. Dielectric is along an outward-facing surface of the heat spreader, whereby the dielectric inhibits the heat spreader from directly contacting and electrically shorting one or more components when the one or more components are under the BLS.
申请公布号 US2016242321(A1) 申请公布日期 2016.08.18
申请号 US201514734715 申请日期 2015.06.09
申请人 Laird Technologies, Inc. 发明人 van Haaster Philip;Boetto Joseph C.;Crotty, JR. Paul W.;Robinson Kenneth M.;Strader Jason L.
分类号 H05K7/20;B23P15/26 主分类号 H05K7/20
代理机构 代理人
主权项 1. A mid-plate for an electronic device, the mid-plate comprising: one or more recessed portions along a surface of the mid-plate; a heat spreader within the one or more recessed portions; and dielectric along an outward-facing surface of the heat spreader, whereby the dielectric inhibits the heat spreader from directly contacting and electrically shorting one or more components.
地址 Earth City MO US