SUBSTRATE CONTAINING LOW-Dk-CORE GLASS FIBERS HAVING LOW DIELECTRIC CONSTANT (Dk) CORES FOR USE IN PRINTED CIRCUIT BOARDS (PCBs), AND METHOD OF MAKING SAME

摘要

An enhanced substrate for use in printed circuit boards (PCBs) includes low-Dk-core glass fibers having low dielectric constant (Dk) cores. In some embodiments, the low-Dk-core glass fibers are filled with a low Dk fluid, such as a gas (e.g., air, nitrogen and/or a noble gas) or a liquid. After via holes are drilled or otherwise formed in the substrate, silane is applied to the ends of hollow glass fibers exposed in the via holes to seal the low Dk fluid within the cores of the hollow glass fibers. In some embodiments, the low-Dk-core glass fibers are filled with a solid (e.g., a low Dk resin). For example, a hollow glass fiber may be provided, and then filled with a low Dk resin in a liquid state. The low Dk resin within the hollow glass fiber is then cured to a solid state.

主权项

1. An apparatus, comprising:
a substrate having a plurality of insulator layers and one or more conductive traces, wherein each of the insulator layers comprises a glass fiber substrate impregnated with a varnish coating, wherein the glass fiber substrate of one of the insulator layers includes one or more low-Dk-core glass fibers each having a low dielectric constant (Dk) core comprising either a low Dk fluid core sealed within a hollow glass fiber shell or a low Dk solid core surrounded by a hollow glass fiber shell, and wherein the Dk value of the low Dk core is less than that of the hollow glass fiber shell.