发明名称 LEDランプ
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED lamp that achieves weight saving while improving heat dissipation property. <P>SOLUTION: The LED lamp includes: a longer form glass tube 3; a mounted substrate 5 including on a surface thereof an SMD LED 7 composed by sealing an LED device mounted on an element packaging substrate and provided in the glass tube 3 while bridging separated two parts on an internal surface of the glass tube 3; and an adhesive material 9 jointing the mounted substrate 5 with the glass tube 3. In the LED lamp 1, end edges extending to a longitudinal direction of the mounted substrate 5 contact with the internal surface of the glass tube 3, and the adhesive material 9 fills between a back surface of the mounted substrate 5 and the internal surface of the glass tube 3. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP5834224(B2) 申请公布日期 2015.12.16
申请号 JP20090297729 申请日期 2009.12.28
申请人 パナソニックIPマネジメント株式会社 发明人 杉田 和繁;瀬戸本 龍海;覚野 吉典;関 勝志;植本 隆在;永井 秀男
分类号 F21V29/00;F21S2/00;F21V3/02;F21V19/00 主分类号 F21V29/00
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