AN ELECTRONIC DEVICE AND THE METHOD FOR FABRICATING THE SAME

摘要

According to embodiments of the present invention, provided is a method for manufacturing an electronic device. The method includes: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer and an electronic element on the carrier substrate in sequence; forming a first elastic layer having a corrugated surface in the wiring region on the sacrificial layer; forming metal wirings on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings on the first elastic layer; forming a high rigidity pattern having a corrugated surface, in a recess of the second elastic layer above the electronic element; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.