发明名称 |
Miniature microphone assembly with solder sealing ring |
摘要 |
The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal. |
申请公布号 |
EP2094028(B1) |
申请公布日期 |
2016.11.02 |
申请号 |
EP20090153067 |
申请日期 |
2009.02.18 |
申请人 |
EPCOS PTE LTD |
发明人 |
JOHANSEN, LEIF STEEN;HØVESTEN, PER FLEMMING;ROCCA, GINO |
分类号 |
B81C1/00;H04R19/01 |
主分类号 |
B81C1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|