SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device, on which a plurality of mutually different semiconductor devices is mounted and reliability of a semiconductor device junction is improved from a viewpoint of heat conduction and electric conduction.SOLUTION: A semiconductor device (10) includes: a die pad (2); a MOS-FET(11); and a GaN-HEMT(13). The MOS-FET(11) is connected to the die pad (2) with a solder (12). The GaN-HEMT(13) is connected to the die pad (2) with a sintered silver (14) whose melting point after sintering is higher than a melting point of the solder (12). The solder (12) is not interposed between the die pad (2) and the sintered silver (14).SELECTED DRAWING: Figure 2