FABRICATION METHOD OF SEMICONDUCTOR DEVICES FOR REDUCING A SPACE BETWEEN PATTEKUN

摘要

PURPOSE: A fabrication method of semiconductor devices is provided to reduce a space between photoresist patterns by using cross-linked reaction between the photoresist patterns and a water soluble polymer. CONSTITUTION: The method comprises the steps of sequentially forming a substance layer(102) and a photoresist layer(104) on a semiconductor substrate(100); forming a photoresist pattern(104a) having a space(106) of a first width(a); forming a water soluble polymer(108) on entire surface of the semiconductor substrate(100); cross-linking the contact portion between the photoresist pattern(104a) and the water soluble polymer(108) by baking the resultant structure; forming a polymer substance pattern(110a) surrounding the photoresist pattern(104a) by developing the water soluble polymer using deionized water and forming a photoresist pattern having a space(112) of a second width(b); and forming a substance pattern(102a) having a space(112) of a second width(b) by etching the substance layer(102) using the photoresist pattern and the polymer substance pattern(110a).