发明名称 |
A PACKAGE FOR SOLID-STATE IMAGE SENSING APPARATUS AND A SOLID IMAGE SENSING APPARATUS |
摘要 |
A solid-state image sensing device package and a solid-state image sensing device are provided to reduce stress generated in the package to prevent a solid-state image sensing device accommodated in the package from being bent to restrain characteristic deterioration of the solid-state image sensing device. A solid-state image sensing device package includes a case body(1a), and a lead. The case body is made of a resin and has a recess(1a1). The lead is extended from the recess to the outside of the case body through the sidewall(1a2) of the case body. An outer lead part(2b1) of the lead has a bent portion which is asymmetrical for the center line of the outer lead part. |
申请公布号 |
KR20070094559(A) |
申请公布日期 |
2007.09.20 |
申请号 |
KR20070026131 |
申请日期 |
2007.03.16 |
申请人 |
SUMITOMO CHEMICAL CO., LTD.;KABUSHIKI KAISHA TOSHIBA |
发明人 |
MAEDA MITSUO;MATSUMI YASUO;YOSHIDA TAKUJI;IDE JUNICHI |
分类号 |
H04N5/225;H01L27/146 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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