发明名称 SYSTEMS AND METHODS FOR PASSIVE COOLING OF COMPONENTS WITHIN ELECTRICAL DEVICES
摘要 A system includes an electrical enclosure, a first electrical unit, a first electrical module, a first heat spreader, and a heat sink. The first electrical unit is removably disposed within the electrical enclosure, and the first electrical unit includes a first surface opposite to a second surface. The first electrical module is removably disposed within the first electrical unit, and the first electrical module is inserted into the first electrical unit in a first direction from the first surface to the second surface. The first heat spreader is coupled to the first electrical module, and the first heat spreader comprises a first tapered coupling. The heat sink includes a second tapered coupling. The second tapered coupling is couples with the first tapered coupling of the first heat spreader to form a physical thermal connection that facilitates heat transfer between the first electrical module and the heat sink.
申请公布号 CA2895388(A1) 申请公布日期 2015.12.26
申请号 CA20152895388 申请日期 2015.06.25
申请人 GENERAL ELECTRIC COMPANY 发明人 TATTA, ANTHONY DOMINIC;VILAGY, JONATHAN;PETERSON, CRAIG ANDREW
分类号 H05K7/20;H05K7/10 主分类号 H05K7/20
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