| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape for semiconductor wafer surface protection which allows the damage to a semiconductor wafer and a chip to be reduced even when grinding the backside of the semiconductor wafer after forming a property-modification layer inside the semiconductor wafer by condensing laser light inside the semiconductor wafer, and enables the grinding of a semiconductor wafer with a high total thickness variation (TTV).SOLUTION: An adhesive tape for semiconductor wafer surface protection according to the present invention is used to protect a surface of a semiconductor wafer. When polishing the backside of a semiconductor wafer in which a property-modification region is formed by laser irradiation while focusing laser light to the inside of the semiconductor wafer, the adhesive tape is stuck to a surface of the semiconductor wafer on which a circuit pattern is formed. The adhesive tape comprises: a base film; and an adhesive layer on at least one side of the base film. The adhesive tape has an elastic modulus of 75 MPa or larger, and a stress relaxation rate of 10-18% or smaller. |
