ELECTRONIC DEVCIE WITH CHIP-ON-FILM PACKAGE

摘要

An electronic device with COF package is provided. The electronic device includes a flexible substrate, a core circuit unit, multiple output pads and multiple switching elements. First terminals of the switching elements are respectively and electrically connected to output pads of the core circuit unit, and second terminals of the switching elements are respectively and electrically connected to the output pads. In a test stage of the electronic device, the switching elements are sequentially turned on such that one of multiple output signals of the core circuit unit is transmitted to a common test pad outside of the electronic device through corresponding one of the output pads.

主权项

1. An electronic device with chip-on-film package, comprising:
a flexible substrate; a core circuit unit disposed in the flexible substrate; multiple output pads disposed in the flexible substrate, wherein the multiple output pads comprise a first output pad and a second output pad; and multiple switching elements comprising a first switching element and a second switching element, wherein a first terminal and a second terminal of the first switching element are electrically connected to a first output terminal of the core circuit unit and the first output pad, respectively, and a first terminal and a second terminal of the second switching element are electrically connected to a second output terminal of the core circuit unit and the second output pad, respectively; wherein, in a test stage of the electronic device, the switching elements are sequentially turned on such that one of multiple output signals of the core circuit unit is transmitted to a common test pad outside of the electronic device through corresponding one of the output pads.