发明名称 Adhesive formulations for bonding composite materials
摘要 <p>Adhesive formulations generally inciuding an acrylate and/or methacrylate monomer; a vinyl ester resin having a weight average molecutar weight ranging from about 450 to about 3000; and a catalyst. Also disciosed are methods for bonding composite materials with the adhesive formulations, and a resin infusion aminating method employing the adhesive formulations.</p>
申请公布号 DK178355(B1) 申请公布日期 2016.01.11
申请号 DK20090000326 申请日期 2009.03.10
申请人 GENERAL ELECTRIC COMPANY 发明人 OLSON, DANIEL ROBERT;LIN, WENDY W.;SEEGER, GEORGE THOMAS
分类号 C09J131/00;B32B37/12;C08J5/00;C08J5/24;C08L31/00;C08L67/00;C09J167/00 主分类号 C09J131/00
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