发明名称 |
Adhesive formulations for bonding composite materials |
摘要 |
<p>Adhesive formulations generally inciuding an acrylate and/or methacrylate monomer; a vinyl ester resin having a weight average molecutar weight ranging from about 450 to about 3000; and a catalyst. Also disciosed are methods for bonding composite materials with the adhesive formulations, and a resin infusion aminating method employing the adhesive formulations.</p> |
申请公布号 |
DK178355(B1) |
申请公布日期 |
2016.01.11 |
申请号 |
DK20090000326 |
申请日期 |
2009.03.10 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
OLSON, DANIEL ROBERT;LIN, WENDY W.;SEEGER, GEORGE THOMAS |
分类号 |
C09J131/00;B32B37/12;C08J5/00;C08J5/24;C08L31/00;C08L67/00;C09J167/00 |
主分类号 |
C09J131/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|