COPPER CONTAINING ALGICIDAL COMPOUNDS

摘要

The present application is directed to a coating composition comprising a ceramic binder and inorganic copper compound particles. Generally, the inor ganic copper compound particles have a median particle size of less than 5 m icrometers. In some embodiments, the particles have a median particle size o f greater than 1 micrometer. The inorganic copper compound particles may be non-photocatalytic. The coating may also be placed on a structural layer.