Method for analyzing impurities of wafer, involves providing drop of fluid between lower drop support and upper drop support, such that lower side of drop is in contact with lower drop support

摘要

The method involves providing a drop of a fluid between a lower drop support (2) and an upper drop support (3), such that a lower side of the drop is in contact with the lower drop support and an upper side of the drop is in contact with the upper drop support. The edge of the wafer (1) is shut down with the drop, during the contact of the edge with a side surface of the drop with suction and analyzing the drop. The surface of the lower and the upper drop support, which comes in contact with the drop, contains polytetrafluoroethylene (PTFE). An independent claim is also included for a device for analyzing the impurities of a wafer.