Radiation Hardened MOS Devices and Methods of Fabrication

摘要

Radiation hardened NMOS devices suitable for application in NMOS, CMOS, or BiCMOS integrated circuits, and methods for fabricating them. A device includes a p-type silicon substrate, a field oxide surrounding a moat region on the substrate tapering through a Bird's Beak region to a gate oxide within the moat region, a heavily-doped p-type guard region underlying at least a portion of the Bird's Beak region and terminating at the inner edge of the Bird's Beak region, a gate included in the moat region, and n-type source and drain regions spaced by a gap from the inner edge of the Bird's Beak and guard regions. A variation of minor alterations to the conventional moat and n-type source/drain masks. The resulting devices have improved radiation tolerance while having a high breakdown voltage and minimal impact on circuit density.

主权项

1. An integrated circuit, comprising:
a silicon substrate having a moat region for a device, a channel region positioned within the moat region, and a diffusion region positioned within the moat region and adjacent to the channel region along a length direction of the device; a field oxide layer formed above the silicon substrate, the field oxide layer having a tapered edge surrounding the moat region; and a gate layer formed above the silicon substrate, the gate layer extending across the moat region along the length direction of the device, and the gate layer abutting the tapered edge of the field oxide layer.