| 发明名称 |
SUBSTRATE FOR EMBEDDING IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME, AND IMAGING APPARATUS |
| 摘要 |
A substrate for embedding an imaging device includes: a core layer; a first multilayered wiring layer that is formed onto the core layer, the core layer and the first multilayered wiring layer having a cavity penetrating therethrough; a second multilayered wiring layer that is formed onto the core layer on a side opposite to the first multilayered wiring layer and that includes a conductive pattern formed at a position facing the cavity; a resin portion that is arranged inside the cavity and includes a bottom surface supported by the second multilayered wiring layer, a side face supported by the core layer, and a curved surface formed on a side opposite to the bottom surface; and an imaging device adhered along the curved surface inside the cavity. |
| 申请公布号 |
US2016163751(A1) |
申请公布日期 |
2016.06.09 |
| 申请号 |
US201514960094 |
申请日期 |
2015.12.04 |
| 申请人 |
TAIYO YUDEN CO., LTD. |
发明人 |
SUGIYAMA Yuichi;MIYAZAKI Masashi;HAMADA Yoshiki |
| 分类号 |
H01L27/146;H01L31/0203 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate for embedding an imaging device, comprising:
a core layer; a first multilayered wiring layer that is formed onto the core layer, the core layer and the first multilayered wiring layer having a cavity penetrating therethrough; a second multilayered wiring layer that is formed onto the core layer on a side opposite to the first multilayered wiring layer and that includes a conductive pattern formed at a position facing the cavity; a resin portion that is arranged inside the cavity and includes a bottom surface supported by the second multilayered wiring layer, a side face supported by the core layer, and a curved surface formed on a side opposite to the bottom surface; and an imaging device adhered along the curved surface inside the cavity. |
| 地址 |
Tokyo JP |
