Electrodeposition of Copper

摘要

In electrolytic copper plating, an aqueous composition comprising a source of copper ions and at least one alkylene or polyalkylene glycol monoether which is soluble in the aqueous phase and has molecular weight not greater than about 500 for improving the efficacy of other additives such as, for example, levelers and suppressors; and a related plating method.

主权项

1. A n aqueous composition for electroplating copper comprising a source of copper ions and one or more alkylene or polyalkylene glycol ethers having the following general Structure (1) or (2):
R1O[CH2CHR2O]nR3  Structure (1) R1O[CH2CHR2O]n[CH2CHR4O]mR3  Structure (2) wherein R1 is a substituted or unsubstituted alkyl group having 1 to 6 carbon atoms, a cycloalkyl group, or an aryl group; R2 is H or is a substituted or unsubstituted alkyl group having from 1 to 3 carbon atoms; R4 is H or a substituted or unsubstituted alkyl group having from 1 to 3 carbon atoms, R4 being different from R2; R3 is H or —CH2CH(OH)CH2—OH, and n and m are such that the alkylene or polyalkylene glycol ether is soluble in the aqueous phase and has molecular weight not greater than about 500.