发明名称 |
SOURCE SUPPLY APPARATUS, SOURCE SUPPLY METHOD AND STORAGE MEDIUM |
摘要 |
A source supply apparatus configured to supply a source material sublimated from a solid source material together with a carrier gas to a source consumption zone, includes a source material supplier defining a sealed space and resolidifying and precipitating the source material in a thin film form of, a carrier gas supply passage through which the carrier gas is supplied to the source material supplier, a temperature adjustment part configured to adjust temperature of the source material supplier, a supply passage through which the source material and the carrier gas are supplied from the source material supplier to the source consumption zone, a flow rate measurement part measuring a flow rate of the source material supplied from the source material supplier to the source consumption zone, and a controller configured to control the temperature adjustment part based on a measured flow rate obtained from the flow rate measurement part. |
申请公布号 |
US2016281231(A1) |
申请公布日期 |
2016.09.29 |
申请号 |
US201615079435 |
申请日期 |
2016.03.24 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
MOROI Masayuki;MAEKAWA Koji |
分类号 |
C23C16/455;C23C16/52 |
主分类号 |
C23C16/455 |
代理机构 |
|
代理人 |
|
主权项 |
1. A source supply apparatus configured to supply a source material sublimated from a solid source material together with a carrier gas to a source consumption zone, comprising:
a source material supply source defining a sealed space and configured to resolidify and precipitate the source material sublimated from the solid source material in a form of a thin film therein; a carrier gas supply passage through which the carrier gas is supplied to the source material supply source; a temperature adjustment part configured to adjust temperature of the source material supply source; a supply passage through which the source material sublimated from the solid source material and the carrier gas are supplied from the source material supply source to the source consumption zone; a flow rate measurement part configured to measure a flow rate of the source material supplied from the source material supply source to the source consumption zone; and a controller configured to control the temperature adjustment part based on a measured flow rate value obtained from the flow rate measurement part. |
地址 |
Tokyo JP |