发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To enhance uniformity of etching by using electro static charge of a substrate.SOLUTION: The substrate processing apparatus includes: substrate holding means; etching liquid supply means; and a control device for controlling a plurality of electrodes. The control device performs an etching step of supplying a substrate with an etching liquid while rotating the substrate about a rotary axis line and an etching electrification step for electrifying the substrate in parallel with the etching step by applying a voltage to a plurality of electrodes so that absolute values of applied voltages are increased in an order of a first electrode and a second electrode.SELECTED DRAWING: Figure 7
申请公布号 JP2016184701(A) 申请公布日期 2016.10.20
申请号 JP20150064945 申请日期 2015.03.26
申请人 SCREEN HOLDINGS CO LTD 发明人 TAKAHASHI HIROAKI;OTSUJI MASAYUKI
分类号 H01L21/306;H01L21/304 主分类号 H01L21/306
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