| 摘要 |
PROBLEM TO BE SOLVED: To thermally couple each of a plurality of heating components with each of a plurality of heat radiation parts with stability even in a case where the plurality of heating components have different heights.SOLUTION: First and second heat radiation parts 120a and 120b are thermally coupled with a memory 220 and a CPU 230 mounted on a surface of a substrate 210, respectively. A frame 130 is placed on the surface of the substrate. First and second openings 131a and 131b are formed at a position corresponding to a position where the first and second heat radiation parts are provided, in the frame 130. First and second elastic rubbers 150a and 150b (first and second connection parts) are provided at the circumferential edges of the first and second openings. In addition, the first and second elastic rubbers connect the first and second heat radiation parts with the frame.SELECTED DRAWING: Figure 1 |
