发明名称 VACUUM BONDING METHOD AND VACUUM BONDING DEVICE
摘要 <p>Removal force and removal electrostatic charge of a work are reduced. Since a planar work (B) bonded in a vacuum chamber (S) is separated from a holding plate (2) in vacuum, atmospheric pressure is not applied to the planar works (A, B). Thus, the work is separated with a small removal force, and since minute unevenness exists on the surfaces thereof and they are not in strong contact, generation of static electricity incident to removal is moderate. When the chamber (S) is opened to the atmosphere subsequently under the separated state, generation of static electricity is retarded between the planar works (A, B) and the work side surfaces(1a, 2a) of the holding plates (1, 2).</p>
申请公布号 WO2008114337(A1) 申请公布日期 2008.09.25
申请号 WO2007JP53261 申请日期 2007.02.22
申请人 SHIN-ETSU ENGINEERING CO., LTD.;OHTANI, YOSHIKAZU 发明人 OHTANI, YOSHIKAZU
分类号 B65G49/06;H01L21/683 主分类号 B65G49/06
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