| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high frequency circuit board capable of forming a plurality of transmission lines while securing predetermined isolation within a limited board size. <P>SOLUTION: Strip conductors 22, 32 are stacked across dielectric films 21, 31 on ground conductors 11, 12 of a coplanar line 10. Then, the front-surface ground conductor of the coplanar line 10 and rear-surface ground conductors of microstrip lines 20, 30 are made common. <P>COPYRIGHT: (C)2010,JPO&INPIT |
