MULTILAYER STRUCTURE FOR ACCOMMODATING ELECTRONICS AND RELATED METHOD OF MANUFACTURE

摘要

Multilayer structure (200) for electronic devices, including a flexible substrate film (102) for accommodating electronics, a number of electrical elements (204, 206) provided to the flexible substrate film, preferably by element of printed electronics and/or surface mounting, a protective layer (104) laminated onto at least first surface of the substrate film, the protective layer being configured to mask perceivable physical deviation of the substrate, such as uneven surface profile or coloring, substantially at the location of the number of elements, from outside perception, optionally visual perception and/or tactile inspection taking place via the protective layer, and plastic layer (106) molded over at least second surface of the substrate film opposite to the first surface. A corresponding method of manufacture is presented.

主权项

1. Multilayer structure (101B, 101C, 200, 300) for electronic devices, comprising
a flexible substrate film (102) for accommodating electronics, a number of electrical elements (204, 206) provided to said flexible substrate film, preferably by means of printed electronics and/or surface mounting, a protective layer (104) on at least first surface (102A) of said substrate film, said protective layer being configured to mask perceivable physical deviation (302, 304) of the substrate, such as uneven surface profile or coloring, substantially at the location of said number of elements, from outside perception, preferably visual perception and/or tactile inspection taking place via the protective layer, and plastic layer (106) molded onto at least second surface (102B) of said substrate film opposite to said first surface.