| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting device capable of preventing a resin sealing part of a backlight or an LED chip or the like from being scratched due to a human error or impression of a collet or the like.SOLUTION: A method for manufacturing a light-emitting device comprises the steps of: mounting a light-emitting element 12 on a substrate 11 (element mounting step); forming a partition 14 on the substrate 11 so as to surround a light-emitting element mounting part with a first resin which is a thermosetting resin having reflectivity (partition forming step); and forming a sealing part 15 for sealing the light-emitting element 12 in the partition 14 with a second resin which is a thermosetting resin (element sealing step). Height from a surface of the substrate 11 of the partition 14 is formed higher than a sealing resin 15. The partition 14 is apparently formed of a harder resin than the sealing part 15. The partition forming step forms a partition by supplying an uncured first region to the substrate 11 by printing or dropping and then curing the first resin. |
