| 摘要 |
A polyimide resin composition which produces a heat-conductive adhesive film having specifically satisfactory electrical insulation properties and thermal conductivity, exhibiting adhesiveness at a low temperature of about 170° C. to 200° C., and exhibiting a glass transition temperature of higher than 200° C. after lamination of the film, is provided. Disclosed is a resin composition including an aromatic polyimide resin (A) containing phenolic hydroxyl groups; a filler (B); and an epoxy resin (C) having a melt viscosity of 0.04 Pa·s or less, wherein the ratio of the amounts in parts by mass of the polyimide resin (A), the filler (B), and the epoxy resin (C) satisfies the relationships: (A):(C)=99:1 to 1:99, and ((A)+(C)):(B)=80:20 to 5:95. |
