| 发明名称 |
SUBSTRATE SUPPORT WITH IMPROVED RF RETURN |
| 摘要 |
Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a body having a support surface; an RF electrode disposed in the body proximate the support surface to receive RF current from an RF source; a shaft to support the body; a conductive element having an interior volume and extending through the shaft, wherein the conductive element is coupled to the RF electrode; and an RF gasket; wherein the conductive element includes features that engage the RF gasket to return the RF current to ground. |
| 申请公布号 |
US2016240426(A1) |
申请公布日期 |
2016.08.18 |
| 申请号 |
US201615019573 |
申请日期 |
2016.02.09 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
KAMATH ARAVIND MIYAR;TSAI CHENG-HSIUNG;RAVI JALLEPALLY;MATSUSHITA TOMOHARU;CHANG YU |
| 分类号 |
H01L21/687;H01L21/67 |
主分类号 |
H01L21/687 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate support, comprising:
a body having a support surface; an RF electrode disposed in the body proximate the support surface to receive RF current from an RF source; a shaft to support the body; a conductive element having an interior volume and extending through the shaft, wherein the conductive element is coupled to the RF electrode; and an RF gasket, wherein the conductive element includes features that engage the RF gasket to return the RF current to ground. |
| 地址 |
Santa Clara CA US |
