| 发明名称 |
CHUCK TABLE OF PROCESSING APPARATUS |
| 摘要 |
A chuck table in processing apparatus holds a frame unit in which a wafer is fixed to an opening of a ring-shaped frame with an intermediary of adhesive tape by sucking an exposed surface of the wafer to a holding surface. The chuck table includes a circular region that forms the holding surface in which plural suction holes communicating with a suction source are formed, and a ring-shaped circumferential region that surrounds the circular region. The diameter of the circular region is smaller than the diameter of the wafer. The circumferential region is formed to include a diameter larger than the diameter of the wafer and smaller than the inner diameter of the ring-shaped frame, and a recess that suppresses the sticking of the adhesive tape is formed in an upper surface of the circumferential region that gets contact with the adhesive tape. |
| 申请公布号 |
US2016240424(A1) |
申请公布日期 |
2016.08.18 |
| 申请号 |
US201615042443 |
申请日期 |
2016.02.12 |
| 申请人 |
DISCO CORPORATION |
发明人 |
Tsukamoto Masahiro;Togashi Ken |
| 分类号 |
H01L21/687;H01L21/683 |
主分类号 |
H01L21/687 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chuck table of processing apparatus for holding a frame unit in which a wafer is fixed to an opening of a ring-shaped frame with intermediary of adhesive tape by sucking an exposed surface of the wafer by a holding surface, the chuck table comprising:
a circular region that forms the holding surface in which a plurality of suction holes communicating with a suction source are formed, and a ring-shaped circumferential region that surrounds the circular region, wherein the circular region is smaller than a diameter of the wafer, and the circumferential region is formed to be larger than the diameter of the wafer and be smaller than an inner diameter of the ring-shaped frame, and a recess that suppresses sticking of the adhesive tape is formed in an upper surface of the circumferential region that gets contact with the adhesive tape. |
| 地址 |
Tokyo JP |
