METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY

摘要

Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the first conductive trace structure and the second conductive trace structure, and placing a magnet on a resist material disposed on a portion of each of the first and second conductive trace structures, wherein the resist material does not extend over the cavity.

主权项

1. A microelectronic sensor integrated package structure comprising:
a package substrate comprising a dielectric material; a first conductive trace and a second conductive trace disposed directly on the dielectric material, wherein the first conductive trace is located in a first metal layer of the dielectric material and the second conductive trace is located in a second metal layer of the dielectric material; a resist material disposed directly on a portion of the first conductive trace; a magnet disposed directly on at least a portion of the resist material; and a cavity disposed between the magnet and the first trace, wherein the resist material does not extend across the cavity, and wherein the magnet is directly adjacent the cavity.