| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition containing a halogen-free flame retardant, from which a solder resist layer with low warpage and excellent in flame retardancy and bending property can be formed, and to provide a dry film of the composition, and a printed wiring board on which a flame retardant cured film of a solder resist or the like using the composition is formed.SOLUTION: The curable resin composition for manufacturing a printed wiring board comprises (D) a thermosetting component having two or more cyclic ether groups and/or cyclic thioether groups in the molecule, (B) aluminum hydroxide and (C) spherical silica. By further incorporating (F) a photopolymerization initiator and (G) a photopolymerizable monomer other than the above components, a photo-curable thermosetting resin composition can be prepared. The composition preferably further contains (E) a phosphorus-containing compound. |
