| 摘要 |
PROBLEM TO BE SOLVED: To provide gripping fingers of a semiconductor wafer to minimize the distortion of the wafer. SOLUTION: The apparatus includes a plurality of wafer gripping fingers 102 for holding a wafer 104 in a predetermined position. Each finger 102 includes a groove 101 that contacts the edge of the wafer 104. The groove and the wafer edge have respective radii re, rf of curvature, in which the radius rf of the curvature of the groove 101 is greater than the radius re of the wafer edge. Each finger 102 includes a rigid member having a recess formed in a central location at one end thereof, and a compliant material such as PEEK disposed in the recess in which the groove 101 is formed. The compliant material extends a first distance beyond the rigid member at the central location of the groove 101 and a second shorter distance beyond the rigid member on each side of the central location. Because the groove areas on each side of the central area are more rigid than the central groove area, the fingers 102 can hold the wafer 104 with a high precision while reducing the distortion of the wafer 104. COPYRIGHT: (C)2005,JPO&NCIPI |
