METHOD AND DEVICE FOR LASER CUTTING AT AN ACUTE ANGLE OF CARRIERS FOR ELECTRONIC COMPONENTS

摘要

The invention relates to a method for cutting a substantially flat carrier for electronic components with a laser beam by mutually displacing the laser beam and the carrier. The invention also relates to a device for cutting a substantially flat carrier for electronic components with a laser beam, comprising: a holder for holding the flat carrier, a laser source, a frame connecting the holder and the laser source, and control means for mutually displacing the laser beam and the holder.