发明名称 PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION CHAMBER HAVING THE SHOWER HEAD FREE FROM THERMAL STRESS-INDUCED DEFORMATION
摘要 A plasma-enhanced chemical vapor deposition chamber having a shower head of thermal stress damping structure is provided to eliminate nonuniform deformation of the shower head by designing an electrode plate and the shower head in a floating structure. A deposition chamber includes a lower body having a susceptor, and an upper body positioned on the lower body. A high-frequency electrode plate is mounted on the upper body, and has a metal plate positioned on a center portion of the upper body, in which a groove is formed on an edge of a lower surface of the metal plate. A shower head is positioned under the high-frequency electrode plate, and a groove is formed on an edge of the shower head. The shower head is connected to the electrode plate via a thin metal plate, and a partition(301) is inserted into the groove between the high-frequency electrode plate and the shower head.
申请公布号 KR20070094413(A) 申请公布日期 2007.09.20
申请号 KR20060025066 申请日期 2006.03.17
申请人 KOSTEK SYSTEMS INC. 发明人 BAE, JUN HO
分类号 H01L21/205 主分类号 H01L21/205
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