发明名称 LEAD FRAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To provide a lead frame capable of forming an anchor shape easily in a lead, while suppressing deformation of the lead.SOLUTION: A lead frame 20 has a dam bar 21, a support bar 22, a die pad 23, and a plurality of leads 24 provided around the die pad 23, and formed in pectinate shape from the dam bar 21 toward the die pad 23. The lead 24 includes an inner lead 30 having a tip 32 on the die pad 23 side, a bent 36 connected with the first end of the inner lead 30 on the opposite side from the tip 32, and an external connection terminal 35 bent downward from the first end via the bent 36, and formed so that the upper surface overlaps the lower surface of the inner lead 30. The inner lead 30, the bent 36 and the external connection terminal 35 are formed integrally.SELECTED DRAWING: Figure 1
申请公布号 JP2016018931(A) 申请公布日期 2016.02.01
申请号 JP20140141584 申请日期 2014.07.09
申请人 SHINKO ELECTRIC IND CO LTD 发明人 HAYASHI SHINTARO
分类号 H01L23/50;H01L23/28 主分类号 H01L23/50
代理机构 代理人
主权项
地址