发明名称 SILVER PASTE, AND CONDUCTIVE MOLDED ARTICLE OBTAINED USING SAME
摘要 The present invention addresses the problem of providing a silver paste capable of forming a conductive silver coating film that exhibits substantially the same resistivity as the resistance value of bulk silver, without variations in the resistivity, during low-temperature firing. The problem is solved by providing a silver paste that includes: an aqueous silver nanoparticle dispersion obtained using a compound having a polyethyleneimine skeleton as a protectant; a compound having a functional group capable of reacting with the nitrogen atoms in the polyethyleneimine; and at least one compound selected from the group consisting of compounds having an amine functional group and compounds having an amide functional group.
申请公布号 WO2016093223(A1) 申请公布日期 2016.06.16
申请号 WO2015JP84381 申请日期 2015.12.08
申请人 DIC CORPORATION 发明人 KAWAMURA KAORI;MORIWAKI MASAYUKI;SANO YOSHIYUKI
分类号 H01B1/22;B22F1/00;B22F9/00;B22F9/20;C08K3/08;C08K3/24;C08K5/16;C08L79/02;C09D5/24;C09D7/12;C09D163/00;C09D171/02;C09D179/02;H01B5/16 主分类号 H01B1/22
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