| 摘要 |
The present invention addresses the problem of constituting a semiconductor module in a small size. A metal wire (212) for connecting a control electrode (101) and a control terminal (21) to each other is raised from the control electrode (101) toward a first conductor section (202) such that a first angle (θ1) is formed, and is formed such that the metal wire becomes substantially parallel to the first conductor section (202) as the metal wire comes close to the first conductor section (202), and is connected to the control terminal (21) such that a second angle (θ2) is formed, said second angle being smaller than the first angle (θ1). |
