RESIN COMPOSITION FOR SEALING, SEMICONDUCTOR DEVICE AND STRUCTURE

摘要

PROBLEM TO BE SOLVED: To stably seal and mold a semiconductor element.SOLUTION: A resin composition for sealing comprises granules including a thermosetting resin (A), wherein a rectangular pressure measured by a rectangular pressure test is 2.0 kgf/cmor less, and in a half shot index test, deposition of the resin composition to a metal plate is not observed.SELECTED DRAWING: Figure 1