| 发明名称 |
ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING THE ENCAPSULATING RESIN COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE ENCAPSULATING RESIN COMPOSITION |
| 摘要 |
An encapsulating resin composition contains a thermosetting resin component, a curing accelerator, an inorganic filler, an ion trapping agent, and an aromatic monocarboxylic acid having one or more electron-withdrawing functional groups selected from a nitro group and a cyano group. The encapsulating resin composition is solid at 25° C., and has a sulfur content, measured by X-ray fluorescence analysis, of 0.1 mass % or less in terms of SO3. |
| 申请公布号 |
US2016289443(A1) |
申请公布日期 |
2016.10.06 |
| 申请号 |
US201615075227 |
申请日期 |
2016.03.21 |
| 申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
IWATANI EMI;OGAWA KAZUTO;ISHIKAWA KOTA;TSUJI TAKAYUKI |
| 分类号 |
C08L63/00;H01L21/56;H01L23/495;H01L23/00;H01L23/31;H01L23/29 |
主分类号 |
C08L63/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An encapsulating resin composition comprising:
a thermosetting resin component; a curing accelerator; an inorganic filler; an ion trapping agent; and an aromatic monocarboxylic acid having one or more electron-withdrawing functional groups selected from a nitro group and a cyano group, wherein the encapsulating resin composition is solid at 25° C., and has a sulfur content, measured by X-ray fluorescence analysis, of 0.1 mass % or less in terms of SO3. |
| 地址 |
Osaka JP |
