| 摘要 |
PROBLEM TO BE SOLVED: To provide a film for semiconductor device capable of suppressing degradation of visibility of various information to be marked, by suppressing a transcript mark to a film for flip-chip semiconductor back surface when rolled up.SOLUTION: A film for semiconductor device includes a film for flip-chip semiconductor back surface with a plurality of dicing tapes arranged on a separator at a predetermined interval, and an outside sheet arranged on the outside of the film for flip-chip semiconductor back surface with dicing tapes. The film for flip-chip semiconductor back surface with dicing tapes has dicing tapes and a film for flip-chip semiconductor back surface. Assuming the length of the outside sheet at the narrowest part is G, and the length from the long side of the separator to the dicing tape is F, G is in a range of 0.2-0.95 times of F.SELECTED DRAWING: Figure 1 |
