| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
In the present invention, provided are a semiconductor device having a semiconductor-element-mounting substrate on which a semiconductor element has been mounted via an adhesive having an exothermic-reaction curing start temperature of 130 DEG C or below as measured with a differential scanning calorimeter at a heating rate of 10 DEG C/minute, and a process for its fabrication. <IMAGE> |
| 申请公布号 |
EP1111667(A4) |
申请公布日期 |
2005.06.22 |
| 申请号 |
EP19990931560 |
申请日期 |
1999.07.27 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
KOUSAKA, T.;SUZUKI, NAOYA;TANAKA, TOSHIAKI;YASUDA, M.;KANEDA, AIZOU |
| 分类号 |
H01L21/58;H01L23/31;H01L23/498 |
主分类号 |
H01L21/58 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
