发明名称 |
POLISHING PAD FOR PLANARIZATION |
摘要 |
The present invention relates to a polishing pad. In particular, the polishing pad of the present invention comprises a sublayer, a middle layer, and a top layer which can function as a polishing layer. The polishing pad of the present invention is useful for polishing articles and particularly useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer. |
申请公布号 |
EP1542831(A1) |
申请公布日期 |
2005.06.22 |
申请号 |
EP20030754871 |
申请日期 |
2003.09.18 |
申请人 |
PPG INDUSTRIES OHIO, INC. |
发明人 |
ALLISON, WILLIAM, C.;SWISHER, ROBERT;WANG, ALAN, E. |
分类号 |
B24B1/00;B24B37/22;B24B37/24;B24D11/00;B24D13/12;B24D13/14;H01L21/304 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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