| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thinned and miniaturized imaging apparatus. <P>SOLUTION: The imaging apparatus 1 is provided with a main substrate 50 to mount a system IC 40 and an optical unit 10 to lead a light to an imaging element 30 on the same plane, and a sub substrate 70 to be connected to the main substrate 50 through a FPC 55 and to mount a sub part 60. The sub substrate 70 is oppositely arranged to the system IC 40 having a clearance within a width of a lengthwise direction of the main substrate 50 in a manner that the FPC 55 is bent. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
