| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing composition which has high polishing selectivity keeping an industrially useful polishing speed; and to provide a polishing composition which is preferably used in a CMP process inhibiting the occurrence of erosion even if making an overpolish particularly in a process for manufacturing a semiconductor device. SOLUTION: A polishing composition, which contains a resin emulsion including a water soluble resin (A) with an amide group, has a high polishing speed and a high polishing selectivity. COPYRIGHT: (C)2008,JPO&INPIT |
