METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer having a metal ring that has a new structure and can prevent a crack from growing into a semiconductor chip region.SOLUTION: A semiconductor wafer comprises: a first semiconductor chip region 102 in which a semiconductor element is formed; a second semiconductor chip region 102 in which a semiconductor element is formed; and a scribe region 103 sandwiched between the first semiconductor chip region and the second semiconductor chip region. The first semiconductor chip region includes a crack prevention ring 105 surrounding the semiconductor element formed in the first semiconductor chip region. The ring is formed of a plurality of metal layers including a lower metal layer and an upper metal layer overlap the lower metal layer. The upper metal layer overlap the lower metal layer so that the outer side surface of the upper metal layer in the first semiconductor chip region is aligned with the outer side surface of the lower metal layer, or is arranged inside the first semiconductor chip region with respect to the outer side surface of the lower metal layer.SELECTED DRAWING: Figure 6