| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive-type photosensitive polyimide composition which enables processing of a fine pattern, can form a coating film having excellent heat resistance and a linear expansion coefficient proximal to that of a substrate, and does not need imidization at a high temperature. <P>SOLUTION: The positive-type photosensitive polyimide resin composition comprises: a polyimide resin that has a specific skeleton and is soluble in an organic solvent; and a compound (b) that can generate an acid by being irradiated with an active ray. <P>COPYRIGHT: (C)2009,JPO&INPIT |
