发明名称 記憶制御装置の冷却機構
摘要 A cooling mechanism includes a plurality of first circuit boards arranged in parallel with each other, one or more first fans for generating a cooling wind in a first flow path formed along the plurality of first circuit boards, and a connection board arranged orthogonally to the first flow path and at a position different from a position of the first flow path, and coupling the plurality of first circuit boards.
申请公布号 JP5866076(B2) 申请公布日期 2016.02.17
申请号 JP20150528787 申请日期 2013.12.11
申请人 株式会社日立製作所 发明人 岡田 尚規;浅井 俊男;鈴木 弘志
分类号 G06F1/20;H05K7/20 主分类号 G06F1/20
代理机构 代理人
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