发明名称 |
EPITAXIAL SUBSTRATE FOR ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR PRODUCING EPITAXIAL SUBSTRATE FOR ELECTRONIC DEVICE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE |
摘要 |
The present invention is an epitaxial substrate for an electronic device, the epitaxial substrate having a Si-based substrate, an AlN initial layer provided on the Si-based substrate, and a buffer layer provided on the AlN initial layer, and the epitaxial substrate is characterized in that the roughness Sa of the surface on the buffer layer side of the AlN initial layer is 4 nm or more. Due to this configuration, provided is an epitaxial substrate for an electronic device, in which V-shaped pits in the buffer layer structure are prevented and longitudinal leak current characteristics can be improved when an electronic device is produced. |
申请公布号 |
WO2016110906(A1) |
申请公布日期 |
2016.07.14 |
申请号 |
WO2015JP06313 |
申请日期 |
2015.12.18 |
申请人 |
SHIN-ETSU HANDOTAI CO.,LTD.;SANKEN ELECTRIC CO., LTD. |
发明人 |
HAGIMOTO, KAZUNORI;SHINOMIYA, MASARU;TSUCHIYA, KEITARO;GOTO, HIROKAZU;SATO, KEN;SHIKAUCHI, HIROSHI |
分类号 |
H01L21/338;H01L21/20;H01L21/336;H01L29/778;H01L29/78;H01L29/812 |
主分类号 |
H01L21/338 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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