| 摘要 |
A method of fabricating a conductor layer according to the present invention, in which a conductor layer 30 is formed on a substrate 20, includes: first steps S21, S22, S31, S32, S41, and S42 for forming, on the substrate 20, precursor layers 42, 52, and 62 containing at least either metal particles or metal-oxide particles; second steps S23, S33, and S43 for forming sintered layers 44, 54, and 64 by irradiating the precursor layers 42, 52, and 62 with pulse electromagnetic waves; and third steps S24, S34, and S44 for compressing the sintered layers, wherein the conductive layer is formed by repeating the first to third steps N times (where N is a natural number greater than or equal to 2) at the same region of the substrate, and the first to (N-1)th third steps involve forming the surfaces of the sintered layers to have depressions and protrusions. |
