PRINTED CIRCUIT BOARD PRECURSOR

摘要

A printed circuit board precursor includes a substrate, a catalytic layer, a conductive layer, and a metal layer. The substrate has a top surface, a bottom surface, and a wall defining a channel, and the channel completely penetrates through the substrate from the top surface to the bottom surface. The catalytic layer is formed on the top surface, the bottom surface, and the wall of the substrate. The conductive layer is attached to and covers the catalytic layer. The metal layer is disposed on the conductive layers and filled in the channel.

主权项

1. A printed circuit board precursor, comprising:
a substrate having a top surface and a bottom surface, wherein the substrate is formed of polyimide, and the top and bottom surfaces are conducted under 45 to 55 Celsius degrees with pH 11 to 12 strong base for a duration of 1˜3 minutes and are catalytically treated to respectively form a first palladium catalytic layer and a second palladium catalytic layer; a first nickel conductive layer and a second nickel conductive layer, wherein the first and second nickel conductive layers are respectively attached to and cover the first and second palladium catalytic layers; and a first metal layer and a second metal layer, wherein the first and second metal layers are respectively disposed on the first and second nickel conductive layers.