MULTILAYER WIRING BOARD

摘要

A multilayer wiring board includes wiring bodies each including an insulating layer, a conductor layer embedded in the insulating layer and having exposed surface on first surface of the insulating layer, and a conductor post formed on embedded surface of the conductor layer on the opposite side and having end surface on second surface of the insulating layer. The bodies include first and second bodies forming outermost layers on the opposite sides, the exposed surface is recessed from the first surface of the insulating layer in the first body, the end surface is recessed from the second surface in the second body in recess amount greater than that of the exposed surface in the first body, the post of the first body has the exposed surface bonded to the conductor layer of an adjacent body, the second body has the conductor layer bonded to the post of an adjacent body.

主权项

1. A multilayer wiring board, comprising:
a plurality of wiring bodies each comprising a resin insulating layer, a conductor layer embedded in the resin insulating layer such that the conductor layer has an exposed surface exposed from a first surface of the resin insulating layer, and a conductor post comprising a plating material and formed on an embedded surface of the conductor layer on an opposite side with respect to the exposed surface of the conductor layer such that the conductor post is penetrating through the resin insulating layer and has an end surface exposed from a second surface of the resin insulating layer on an opposite side with respect to the first surface, wherein the plurality of wiring bodies includes a first wiring body forming a first outermost layer and a second wiring body forming a second outermost layer on an opposite side with respect to the first outermost layer and is laminated such that the first wiring body electrically connects to the second wiring body, the first wiring body is formed such that the exposed surface of the conductor layer is recessed from the first surface of the resin insulating layer of the first wiring body, the second wiring body is formed such that the end surface of the conductor post is recessed from the second surface of the resin insulating layer in a recess amount which is greater than a recess amount of the exposed surface of the conductor layer in the first wiring body, and the plurality of wiring bodies is laminated such that the conductor post of the first wiring body has the exposed surface directly bonded to the conductor layer of an adjacent one of the wiring bodies and that the second wiring body has the conductor layer directly bonded to the conductor post of an adjacent one of the wiring bodies.